The next generation of skipper Charge Coupled Device (skipper-CCD) experiments for rare-event searches will bring new challenges for the packaging and read-out of the detectors. Scaling the active mass and simultaneously reducing the experimental backgrounds in two orders of magnitude will require a novel high-density Silicon-based package, that must be massively produced and stored. In this work, we present the design, first production, and testing of multi-channel Silicon packages with photon shielding, along with the outlook for the next steps toward producing 1500 wafers that will add up to a 10 kg skipper-CCD detector.